Advanced Energy® is a global leader in the development and support of technologies critical to high-technology manufacturing processes used in the production of semiconductors. Our precise, flexible power systems; reliable gas and liquid flow-management systems; and accurate thermal instruments are all used in the multi-step semiconductor device fabrication, including deposition (PVD, CVD, eletroplate, ALD), chemical removal (etch, strip, CMP), and surface modification processes (ion implantation, RTP).
Power Systems
Flow Management
Source Technology
Thermal Instrumentation
March 26, 2008 - Advances in Radio Frequency Plasma Power Delivery Systems presentation
June 27, 2006 - AE Unveils New Line of Sekidenko Multi-Channel OFTs and Emissometers
May 16, 2006 - AE Awarded Design Win by Leading Provider
Arc Handling in RF-Superimposed DC Processes (2006) white paper
Overview of the Use of Copper Interconnects in the Semiconductor Industry (2004) white paper
Performance Considerations of High-Power AC Plasma Deposition Power Supplies (2004) white paper
Power Supply Topologies (1999) white paper
Beyond Pressure Transients: Using Pressure-Insensitive MFCs to Control Gases In Semiconductor Manufacturing, March 2006 magazine reprint
Powering to better yields, November 2005 magazine reprint
Power Conversion and Control Reduces CoO and Improves Yield, March 2005 magazine reprint
Maximizing tool uptime and process stability through an RF system upgrade, November 2004 magazine reprint
Fabs can ride through voltage sags with power-quality targets, July 2004 magazine reprint
A Novel Frequency-Domain Small-Signal Analysis of Resonant Power Converters, July 2004 magazine reprint
Partial Pressure Control in Reactive Sputtering, June 2004 magazine reprint
A Novel Pulsed Supply With Arc Handling and Leading Edge Control, April 2004 magazine reprint
High Power Pulsed Reactive Sputtering of Zirconium Oxide and Tantalum Oxide, April 2004 magazine reprint
Reactive Sputter Deposition of Aluminum Oxide Coatings, April 2004 magazine reprint
Effective Closed-Loop Control for Reactive Sputtering Using Two Reactive Gases, April 2004 magazine reprint
Stabilizing RF Generator and Plasma Interactions, April 2004 magazine reprint
Optimising performance by integrating RF power and match technologies, December 2007/January 2008 magazine reprint
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